Segment Analysis:
By Type
- Ceramic Binder
- Resin Binder
- Metal Binder
By Application
- Silicon Wafer
- Compound Semiconductor Wafer
- Glass Substrates
- Others
By End-User
- Semiconductor Manufacturers
- Foundries
- IDMs (Integrated Device Manufacturers)
- Research Institutes
By Technology
- Conventional Grinding
- Chemical Mechanical Polishing (CMP)
- Laser Ablation
- Others
Source: PR News Releaser
Wafer Back Grinder Wheels Market: Global Industry …